COB fine-pitch LED displays and conventional SMD-based fine-pitch displays differ significantly in packaging technology, structural robustness, image quality, and application suitability. 1. Packaging & Manufacturing COB (Chip–on–Board): LED chips are directly bonded and encapsulated on the PCB, eliminating the need for reflow soldering and simplifying the production process. Conventional SMD: Uses surfacemount device packaging where…